| process parameters | Rigid PCB |
|---|---|
| Minimum component packaging |
Standard：0402 (1.0×0.5mm) Limit：01005 (0.4×0.2mm) or 0201 |
| Minimum IC pin spacing |
Standard：0.4mm Limit：0.3mm or 0.35mm |
| BGA minimum ball spacing/ball diameter |
Standard：0.5mm Limit：0.3mm |
| Thickness |
Standard：0.8mm - 1.6mm Limit：0.3mm - 6mm |
| Size |
Standard： 70×70mm ~ 460×500mm Limit： 900×600mm |
| SMT accuracy |
Standard：±50μm Limit：±22μm (3σ) |
| Peak temperature of reflow soldering |
Standard：240℃±5℃ or 255℃±5℃ Limit：Supporting precise temperature control under nitrogen protection |
| Key process characteristics | The most mature process, good support, suitable for high-density and large-sized assembly. |
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